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USA
University of South California
The MOSIS Service
Agilent Technologies
Germany
Stuttgart-University
Ruhr-University Bochum
University of Paderborn
France
National Institute
of Application Science
CMP (Circuits Mutil-Projects/Multi-Project
Circuits)
National
Tsinghua University
Fudan University
The HongKong University of
Science & Technology
Institute of Semiconductors Chinese Academy of Science
China Intergrated Circuit
Design Centre
China HUAJING Electronics Group Corporation
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